Tema Files ETF Focused on Semiconductor Packaging and Chiplet Growth

The Tema Semiconductor Packaging ETF will target companies across the semiconductor packaging ecosystem, a critical segment benefiting from AI and advanced chip demand. The actively-managed fund will invest in outsourced semiconductor assembly and test (OSAT) providers, advanced packaging specialists, substrate manufacturers, packaging equipment makers, materials suppliers, and semiconductor testing firms. The strategy emphasizes technologies such as chiplets, 2.5D and 3D packaging, high-bandwidth memory integration, and heterogeneous integration. With global exposure across the U.S., Asia, and Europe, the ETF aims to capitalize on one of the fastest-growing and increasingly strategic areas of semiconductor manufacturing.