GraniteShares Files for ETF Targeting AI Chip Packaging and Stacking

GraniteShares has filed for the GraniteShares Advanced Packaging & Chip Stacking ETF, an actively managed fund targeting semiconductor technologies critical to AI computing. The ETF will invest at least 80% of its assets in advanced packaging companies or related swaps, covering 2.5D and 3D chip packaging, chiplets, high-bandwidth memory integration, advanced substrates, and semiconductor assembly and testing equipment. The strategy will emphasize packaging service providers, materials, and equipment manufacturers rather than traditional memory chipmakers, with a proposed 20% aggregate cap on memory-focused companies. The portfolio will focus on markets including Taiwan, the U.S., Japan, South Korea, and the Netherlands, with quarterly rebalancing and a 20% single-company weighting cap. The fund may also allocate up to 15% to illiquid investments, including private companies and pre-IPO perpetual futures swaps.